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  APTDR40X1601G APTDR40X1601G C rev 2 october, 2012 www.microsemi.com 1-4 absolute maximum ratings symbol parameter max ratings unit v r maximum dc reverse voltage v rrm maximum peak repetitive reverse voltage 1600 v i f dc forward current t c = 80c 40 i fsm non-repetitive forward surge current t=10ms t j = 45c 400 a these devices are sensitiv e to electrostatic discharge. proper handling procedures should be followe d. see application note apt0502 on www.microsemi.com 6 12 2 9 11 5 7 8 10 1 all multiple inputs and outputs must be shorted together 1/2 ; 5/6 ; 7/8 ; 9/10 ; 11/12 v rrm = 1600v i c = 40a @ tc = 80c application ? input rectifiers for inverter ? battery dc power supply features ? high blocking voltage ? high surge current ? low leakage current ? very low stray inductance - symmetrical design ? high level of integration benefits ? solderable terminals for easy pcb mounting ? direct mounting to heatsink (isolated package) ? low profile ? rohs compliant 3 phase rectifier bridge power module downloaded from: http:///
APTDR40X1601G APTDR40X1601G C rev 2 october, 2012 www.microsemi.com 2-4 all ratings @ t j = 25c unless otherwise specified electrical characteristics symbol characteristic test conditions min typ max unit t j = 25c 20 a i r reverse current v r = 1600v t j = 125c 2 ma t j = 25c 1.3 v f forward voltage i f = 40a t j = 125c 1.1 v v t on C state voltage 0.8 v r t on C state slope resistance 10.5 m ? thermal and package characteristics symbol characteristic min typ max unit r thjc junction to case thermal resistance 1.5 c/w v isol rms isolation voltage, any terminal to case t =1 min, 50/60hz 4000 v t j operating junction temperature range -40 150 t stg storage temperature range -40 125 t c operating case temperature -40 100 c torque mounting torque to heatsink m4 2 3 n.m wt package weight 80 g sp1 package outline (dimensions in mm) see application note 1904 - mounting instructions for sp1 power modules on www.microsemi.com downloaded from: http:///
APTDR40X1601G APTDR40X1601G C rev 2 october, 2012 www.microsemi.com 3-4 typical performance curve maximum effective transient thermal impedance, junction to case vs pulse duration 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration in seconds thermal impedance (c/w) forward characteristic t j =25c t j =125c 0 20 40 60 80 0 . 00 . 40 . 81 . 21 . 62 . 0 v f (v) i f (a) non-repetitive forward surge current t j =45c t j =125c 0 100 200 300 400 0.01 0.1 t (s) i fsm (a) 50hz 80% v rrm downloaded from: http:///
APTDR40X1601G APTDR40X1601G C rev 2 october, 2012 www.microsemi.com 4-4 disclaimer the information contained in the document (unless it is publicly available on the web without access restrictions) is proprietary and confidential information of microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of microsemi. if the recipient of this document has entered into a disclosure agreement with microsemi, then the terms of such agreem ent will also apply. this document and the information contained herein may not be modified, by any person other than authorized personnel of microsemi. no license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication , inducement, estoppels or otherwise. any license under such intellectual property rights must be approved by microsemi in writing signed by an officer of microsemi. microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. this product has been subject to limited testing and should not be used in conjunction with life- support or other mission-critical equipment or applications. microsemi assumes no liability whatsoever, and microsemi disclaims any express or implied warranty, relating to sale and/or use of microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or custo mers final application. user or customer shall not rely on any data and performance specifications or parameters provided by microsemi. it is the customers and users responsibility to independently determine suitability of any microsemi product and to test and verify the same. the information contained herein is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the user. microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. the product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp life support application seller's products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the seller's product could create a situation where personal injury, death or property damage or loss may occur (collectively "life support applications"). buyer agrees not to use products in any life support applications and to the extent it does it shall conduct extensive testing of the product in such applications and further agrees to indemnify and hold seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, dam ages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in life support applications, even if such claim includes allegations that seller was negligent regarding the design or manufacture of the goods. buyer must notify seller in writing before using sellers products in life support applications. seller will study with buyer alternative solutions to meet buyer application specification based on sellers sales conditions applicable for the new proposed specific part. downloaded from: http:///


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